By Suryadevara Babu
Advances in Chemical Mechanical Planarization (CMP) provides the newest info on a mainstream approach that's serious for high-volume, high-yield semiconductor production, or even extra in order equipment dimensions proceed to slash. The expertise has grown to surround the elimination and planarization of a number of steel and dielectric fabrics and layers either on the machine and the metallization degrees, utilizing assorted instruments and parameters, requiring advancements within the keep an eye on of topography and defects.
This vital publication bargains a scientific assessment of basics and advances within the region. half One covers CMP of dielectric and steel movies, with chapters concentrating on using specific strategies and methods, and on CMP of specific numerous fabrics, together with extremely low-k fabrics and high-mobility channel fabrics, and finishing with a bankruptcy reviewing the environmental affects of CMP methods.
Part addresses consumables and approach keep an eye on for more suitable CMP, and contains chapters at the education and characterization of slurry, diamond disc pad conditioning, using FTIR spectroscopy for characterization of floor methods, and techniques for defection characterization, mitigation, and reduction.
- Considers concepts and approaches for CMP of dielectric and steel films
- Includes chapters dedicated to CMP for specific materials
- Addresses consumables and method keep an eye on for more advantageous CMP
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Advances in Chemical Mechanical Planarization (CMP) (Woodhead Publishing Series in Electronic and Optical Materials) by Suryadevara Babu